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non-forged hammermill hammer

Patent and Trademake Office

Improved free-swinging hammermill hammer configurations are disclosed and described for comminution of materials such as grain and refuse. The

8/5/2019

hammer

Genesis III, Inc.

The various embodiments disclosed and pictured illustrate a hammer for comminuting various materials. The embodiments pictured and described

7/30/2019

methods for making plants resistant to fungal pathogens

E. I. Du Pont de Nemours and Company

This invention relates to polynucleotide sequences encoding genes that can confer resistance to the plant pathogen Colletotrichum, which causes

7/30/2019

reversibly engaged force-controlled buckle and pelvic ring support

The Seaberg Company, Inc.

A belt-like hip-girdling pelvic sling device for maintaining a desired amount of tension surrounding a person's hips and pelvis to securely

7/10/2019

reversibly engaged force-controlled buckle and pelvic ring support

The Seaberg Company, Inc.

A belt-like hip-girdling pelvic sling device for maintaining a desired amount of tension surrounding a person's hips and pelvis to securely

7/10/2019

reversibly engaged force-controlled buckle and pelvic ring support

The Seaberg Company, Inc.

A belt-like hip-girdling pelvic sling device for maintaining a desired amount of tension surrounding a person's hips and pelvis to securely

7/10/2019

iii-v fin generation by lateral growth on silicon sidewall

International Business Machines of Corporation

A method comprises providing a structure defined by a silicon material on a buried oxide layer of a substrate; causing a nucleation of a III-V

10/3/2018

fin esd protection diode and fabrication method thereof

Taiwain Semiconductor Manufacturing Company, Ltd.

A method comprises forming an active region including a first fin and a second fin over a substrate, wherein the first fin and the second fin

10/3/2018

semiconductor fabrication method including non-uniform cover layer

Semiconductor Manufacturing International (Shanghai) Corporation

A method is provided for fabricating a semiconductor structure. The method includes forming a base substrate including a substrate and a stress

9/23/2018

iii-v fin generation by lateral growth on silicon sidewall

International Business Machines of Corporation

A method comprises providing a structure defined by a silicon material on a buried oxide layer of a substrate; causing a nucleation of a III-V

8/29/2018

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Brazil aims to deflect criticism over Amazon deforestation

Forests

Brazil aims to deflect criticism over Amazon deforestation

In other news: Environmental stories from around the web September 20 2019

Forests

In other news: Environmental stories from around the web September 20 2019

Indonesia is testament to what can happen when we work together on

Forests

Indonesia is testament to what can happen when we work together on

The Story of the Surui Forest Carbon Project

Forests

The Story of the Surui Forest Carbon Project

World’s biggest meatpackers buying cattle from deforesters in Amazon

Forests

World’s biggest meatpackers buying cattle from deforesters in Amazon

Will Smith and Leonardo DiCaprio Team Up to Raise Funds For The Amazon

Forests

Will Smith and Leonardo DiCaprio Team Up to Raise Funds For The Amazon